SW/CAD Engineer- Physical Design

We are looking for a Software Engineer to join our CES-3DIC team in Cairo, Egypt. As a Software Engineer, you will contribute to the development of innovative software products and comprehensive workflow solutions for advanced 2.5D and 3D System-in-Package (SiP) designs. Your work will involve integrating Siemens’ industry-leading EDA and MCAD tools to facilitate architectural planning, physical design and verification, multi-die analysis (electrical, thermal, and mechanical stress), and manufacturing test, making a significant impact on the future of chip design.Responsibilities:* Perform moderately complex development activities, including the design, implementation, maintenance, testing, and documentation of software modules and subsystems for physical design, place-and-route, and 3D packaging.* Develop scalable and customized solutions, streamline and automate workflows, and deploy robust production code using Python, Tcl/Tk, Bash, and other scripting tools and languages focused on physical implementation and packaging.* Apply strong problem-solving skills to identify complex physical design, packaging, tool, or workflow issues and facilitate their resolution.* Improve physical design and packaging flows and methodologies for advanced technology nodes, with a focus on performance, power, and area (PPA) optimization.* Support the integration and enhancement of flows related to floorplanning, placement, routing, power integrity, signal integrity, and physical verification for 3D ICs and advanced packaging.* Collaborate with CAD, 3D/2.5D packaging, and physical implementation teams to address workflow requirements and drive innovation in place-and-route and packaging solutions.* Contribute to the development and integration of 3DBlox-, 3DStack-, and industry standards-based solutions relevant to 3D IC/3DStack architectures and advanced packaging.* Manage design data and EDA infrastructure related to physical design and packaging, including tool installation and maintenance, server environment setup (Linux/Windows), resource monitoring, and troubleshooting.Required Skills:* Bachelor’s degree with 4+ years of experience, or a Master’s degree with 2+ years of experience, in Computer Science, Computer Engineering, Electrical Engineering, or a closely related technical field.* Strong scripting skills in Python, Tcl/Tk, and Shell/Bash.* Strong understanding and hands-on experience with software data structures and software development in Windows and Linux environments.* Prior experience with flow managers and Makefiles for building complex design structures and workflows.* Proficiency in design data management and EDA infrastructure, including organizing large-scale design data, installing and upgrading EDA tools, and managing server environments.* Deep understanding of ASIC physical design methodologies, from RTL synthesis through physical implementation (floorplanning, placement, routing, CTS, timing closure, and physical verification), including expertise in the netlist-to-GDS flow.* Familiarity with version control systems (e.g., Git) and software development methodologies (e.g., Agile and Scrum).* Ability to work both independently and collaboratively within a team with minimal supervision.* Advanced English speaking and writing skills for effective communication within global teams.Preferred Skills:* Hands-on experience with industry-leading place-and-route tools (e.g., Cadence Innovus, Synopsys Fusion Compiler/ICC2, Siemens Aprisa) and physical verification tools (e.g., Siemens Calibre DRC, LVS, and PEX).* Familiarity with package design tools (e.g., Cadence APD/SiP and Siemens Xpedition) and package/interposer planning solutions (e.g., Siemens Innovator 3D IC, Cadence Integrity/Innovus, and Synopsys 3DIC Compiler).* Experience with 3D IC/3DStack solutions and related physical implementation challenges.* Familiarity with IC analysis tools such as Siemens HyperLynx, Ansys HFSS and RedHawk, Cadence Voltus, or Synopsys PrimeTime for signal and power integrity analysis in physical design.* Knowledge of advanced process nodes (e.g., FinFET technologies) and their impact on physical design.If you're interested, apply directly through our website:https://jobs.siemens.com/en_US/externaljobs/JobDetail/505643?ste_sid=493951189421d6e9b857db43ceeb2b94